Product
Technologic High-Flyer
BONDER
Driver IC BONDER(OLB)
Equipment attaching ACF to COF and bonding this COF to a panel by heat and pressure
AOC Bonder, Mold Press, Sharing Stage
Specification
| Corresponding Panel Size | 21" ~ 58" |
|---|---|
| Applicable Material | Glass Panel, ACF, Silicone Sheet, TAB IC |
| Tact Time | 13sec (Process time: ACF 0.7 sec, Pre-compression: 0.1 sec, Main compression: 5secs) |
| Line length | 18,000mm(L) x 3,850(W) x 2,100mm(H) |
| Weight | 25,000Kg |